Thermostream

THERMOSTREAM Systems are used in a variety of temperature testing and conditioning applications. From their traditional applications in semiconductor testing, failure analysis, and device characterization to their broader use in PCB and electronic sub-assembly testing, these have a system with the temperature capabilities to meet your needs. THERMOSTREAM Systems offer an innovative temperature testing solution that allows you to perform device, board, and module testing right where you need it - at your test bench, in your production facility, or in your lab. The speed, precision, and portability of these systems combined with a broader temperature range and capacity have resulted in the most comprehensive line of Temperature Forcing Systems ever.

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[show all brands] Temptronic

Temptronic ATS-505 Thermostream -20° to +225°C Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liquid Nitrogen (LN2) or Liquid Carbon Diox... View Details >>

Temptronic ATS-515 Thermostream -45° to +225°C Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liquid Nitrogen (LN2) or Liquid Carbon Diox... View Details >>

Temptronic ATS-525 Thermostream -60° to +225°C Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liquid Nitrogen (LN2) or Liquid Carbon Diox... View Details >>

Temptronic ATS-545-M Thermostream -80° to +225°C Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liquid Nitrogen (LN2) or Liquid Carbon Diox... View Details >>

Temptronic ATS-605 Thermostream -20° to +225°C Designed for 60Hz operation only, this Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liqu... View Details >>

Temptronic ATS-615 Thermostream -45° to +225°C Designed for 60Hz operation only, this Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liqu... View Details >>

Temptronic ATS-625 Thermostream -60° to +225°C Designed for 60Hz operation only, this advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liqu... View Details >>

Temptronic ATS-645-M Thermostream -80° to +225°C Designed for 60Hz operation only, this Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liqu... View Details >>

Temptronic ATS-710-M Thermostream -80° to +225°C Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liquid Nitrogen (LN2) or Liquid Carbon Diox... View Details >>

Temptronic ATS-730-M Thermostream -90° to +225°C Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liquid Nitrogen (LN2) or Liquid Carbon Diox... View Details >>

Temptronic ATS-750-M Thermostream -90° to +300°C Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liquid Nitrogen (LN2) or Liquid Carbon Diox... View Details >>

Temptronic ATS-770-M Thermostream -100° to +225°C Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liquid Nitrogen (LN2) or Liquid Carbon Diox... View Details >>

Temptronic ATS-810-M Thermostream -80° to +225°C Designed for 60Hz operation only, this Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liqu... View Details >>

Temptronic ATS-830-M Thermostream -90° to +225°C Designed for 60Hz operation only, this Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liqu... View Details >>

Temptronic ATS-850-M Thermostream -90° to +300°C Designed for 60Hz operation only, this Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liqu... View Details >>

Temptronic ATS-870-M Thermostream -100° to +225°C Designed for 60Hz operation only, this Advanced Temperature Source for fast and precise thermal conditioning of components, parts, hybrids, modules, sub-assemblies, and printed circuit boards. Capable of ultra-low temperatures without the use of Liqu... View Details >>

Temptronic TPO3500 ThermoChuck System -65°C to +300°C The TP03500 Series ThermoChuck System is a revolutionary high performance platform providing exceptional flatness, parallelism, mechanical and thermal stability over a wide temperature range for the high precision testing of wafers at the wafer probi... View Details >>

Temptronic TPO4310A Thermal Inducing System -80°C to +225°C The Thermal Inducing Systems are used in a variety of temperature testing and conditioning applications. From their traditional applications in semiconductor testing, failure analysis, and device characterization to their broader use in PCB and elect... View Details >>