Temptronic TPO3500 ThermoChuck System -65°C to +300°C

• Description
• Features
• Specifications

Description

The TP03500 Series ThermoChuck System is a revolutionary high performance platform providing exceptional flatness, parallelism, mechanical and thermal stability over a wide temperature range for the high precision testing of wafers at the wafer probing station. The chuck design is based on new, patented1 technologies from Temptronic Corporation.

The TP03500 System consists of a low noise controller; a temperature controlled vacuum chuck assembly and your choice of cooling options. Available in diameters of 200mm (8 inch) or 300 mm (12 inches), the TP03500 ThermoChuck accommodates a variety of wafer sizes. All ThermoChucks have the ability to shut off outer vacuum rings for better �hold down� of smaller wafers. The chuck surface is electrically isolated and plated (gold, nickel, anodized or other) for your application.

Optional mechanical interface kits and prober-dedicated chuck configurations are available to adapt the ThermoChuck assembly to most probing stations. ThermoChuck Systems may be interfaced to wafer probing stations, laser trimmers or inspection stations.

For device characterization and analytical measurements on wafers and hybrids when the objective is to maintain probe contact during temperature excursions, Temptronic offers the Constant Height ThermoChuck. Designed utilizing Temptronic patented technology, the Constant Height ThermoChuck maintains growth as low as 50 microns and flatness to 50 microns throughout the entire temperature range.

Features

• Patented TP03500 ThermoChuck design provides exceptional thermal and mechanical stability and precision
• Superior Temperature Uniformity:
         At temperatures to +200°C: ±0.5% or ±0.5°C, whichever is greater
         At temperatures = or > 200°C: ±1.0% of set temperature
• Surface Flatness
         @ +200°C: <12.5 microns ( 200 mm ); <25 microns (300mm)
         @ +300°C: <25 microns
• Surface to Base Parallelism: <20 microns @ +200°C
• Surface Isolation: > 109 ohms standard; >1014 ohms available
• Surface Capacitance at ambient:
         200 mm chuck: <750 pf standard, < 250 pf option available
         300 mm chuck: <800 pf standard, < 500 pf option available
• Deflection:
         200 mm: <15 microns at 65 Kg
         300 mm: <6 microns at 50 Kg
• Low noise DC Control System keeps electrical noise to a minimum
• Modular System Design for convenient, cost-effective system upgrades as wafer diameter and temperature requirements change
• CE Approved, ETL listed for U.S.A. and Canada and Compliant with SEMI S2-93A standards