Temptronic TPO4310A Thermal Inducing System -80°C to +225°C

• Description
• Features
• Specifications

Description

The Thermal Inducing Systems are used in a variety of temperature testing and conditioning applications. From their traditional applications in semiconductor testing, failure analysis, and device characterization to their broader use in PCB and electronic sub-assembly testing, the THERMOSTREAM has a system with the temperature capabilities to meet your needs. The THERMOSTREAM Systems offer an innovative temperature testing solution that allows you to perform device, board, and module testing right where you need it - at your test bench, in your production facility, or in your lab.

Features

• Modes of Operation Two - Manual and Program Modes
• Test set-up configurations - 12 Manual Mode test programs and 12 Program Mode test programs may be created
• Test set-up storage - 11 Manual Mode test programs, 11 Program Mode test programs and 11 affiliated “Define Parameters” test set-ups can be stored for later recall.
• Ramp/soak/cycle configurations -  In Program Mode, up to 12 sequences per test set-up; table is displayed on-screen
• DUT temperature control - Patented4 Dual Loop Temperature Control
• Status indicators - Real-time status displayed on-screen and via remoteinterface
• Purge flow tester interface - Dry air purge protects tester electronics protection from condensation
• Purge flow capacity - 0.25 to 1.5 liters per second (0.5 to 3 scfm) airflow
• Calibration - Automated, simplified and accurate for all airflows and DUT types
• Thermal head raising and lowering - Pneumatic control on thermal head, operated manually or via remote interface
• Head positioner movement - Manual locking (4 locks), 360° head rotation; head can be manually pivoted, turned, tilted and vertically swung for ease of interface at tester site.
• Manipulator (arm) movement - Motorized raising and lowering of arm; 330° positioning range around the base unit