Temptronic Corporation, the pioneer and worldwide leader in localized thermal inducing systems, in 1970 introduced the concept of providing accurate, controlled "Temperature On the Spot" at the test site as a convenient alternative to temperature chambers and baths. Bringing precise temperature to the test site for wafers, components, hybrids, printed circuit boards and other devices enables the user to incorporate temperature into any test equipment for characterizing, qualifying and performing fault isolation on a component, PCB, module or wafer for Mil Spec, design or production testing.