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Temptronic TPO3500 ThermoChuck System -65°C to +300°C

Description

The TP03500 Series ThermoChuck System is a revolutionary high performance platform providing exceptional flatness, parallelism, mechanical and thermal stability over a wide temperature range for the high precision testing of wafers at the wafer probing station. The chuck design is based on new, patented1 technologies from Temptronic Corporation.

The TP03500 System consists of a low noise controller; a temperature controlled vacuum chuck assembly and your choice of cooling options. Available in diameters of 200mm (8 inch) or 300 mm (12 inches), the TP03500 ThermoChuck accommodates a variety of wafer sizes. All ThermoChucks have the ability to shut off outer vacuum rings for better “hold down” of smaller wafers. The chuck surface is electrically isolated and plated (gold, nickel, anodized or other) for your application.

Optional mechanical interface kits and prober-dedicated chuck configurations are available to adapt the ThermoChuck assembly to most probing stations. ThermoChuck Systems may be interfaced to wafer probing stations, laser trimmers or inspection stations.

For device characterization and analytical measurements on wafers and hybrids when the objective is to maintain probe contact during temperature excursions, Temptronic offers the Constant Height ThermoChuck. Designed utilizing Temptronic patented technology, the Constant Height ThermoChuck maintains growth as low as 50 microns and flatness to 50 microns throughout the entire temperature range.

Features

• Patented TP03500 ThermoChuck design provides exceptional thermal and mechanical stability and precision
• Superior Temperature Uniformity:
         At temperatures to +200°C: ±0.5% or ±0.5°C, whichever is greater
         At temperatures = or > 200°C: ±1.0% of set temperature
• Surface Flatness
         @ +200°C: <12.5 microns ( 200 mm ); <25 microns (300mm)
         @ +300°C: <25 microns
• Surface to Base Parallelism: <20 microns @ +200°C
• Surface Isolation: > 109 ohms standard; >1014 ohms available
• Surface Capacitance at ambient:
         200 mm chuck: <750 pf standard, < 250 pf option available
         300 mm chuck: <800 pf standard, < 500 pf option available
• Deflection:
         200 mm: <15 microns at 65 Kg
         300 mm: <6 microns at 50 Kg
• Low noise DC Control System keeps electrical noise to a minimum
• Modular System Design for convenient, cost-effective system upgrades as wafer diameter and temperature requirements change
• CE Approved, ETL listed for U.S.A. and Canada and Compliant with SEMI S2-93A standards

Specifications

System

Control method

DC Proportional, Integral, Derivative (PID)

Remote control

RS232, IEEE-488

Local control

Touch pad, vacuum fluorescent display

Temperature accuracy

±0.5°C ( when calibrated against NIST standard)

Temperature stability

±0.1°C

Temperature resolution

0.1°C

Ambient operating temperature

+10° to +30°C

Humidity operating range

0 to 90%, non-condensing

Overheat protection temperature

Redundant RTD

Temperature Display

0.1°C resolution

Audible Noise of System

62 dbA

Refrigerants

HCFC-free and CFC-free, non-toxic, non-flammable

Industry Certifications

Compliant with CE and ETL and conforms to the SEMI S2-93A safety

Facility Requirements

Power

200 - 250 VAC (230V nominal), 60Hz, 30 amp, 1phase

Clean, Dry Air (CDA)

Filtered to 5 micron particulate contamination.

Oil Content: <0.1 ppm, by weight, filtered to 0.01 micron oil contaminant.

Dew point: <-10°C @ 6.2 BAR (90PSI)

Fluid

1.5 liters (50.7 fl. oz.). For fluid type, contact factory

Vacuum

600 mm HG.

WEIGHT

Complete System (standard ), packed with accessories

TP03500A

317 kg. (700 lb.) approximately

TP03500C

Check with factory

TP03500D

Check with factory

TP03500E

 Check with factory

Standards

CISPR
CISPR 11
CISPR 14 - 1
CISPR 14 - 2
CISPR 14 - 2
CISPR 16 - 1
CISPR 16 - 2
CISPR 16 - 3
CISPR 16 - 4
CISPR 22
CISPR 24
IEC
IEC/TR EN 61000 - 1 - 1
IEC/TR EN 61000 - 2 - 1
IEC/TR EN 61000 - 2 - 3
IEC EN 61000 - 3 - 2
IEC EN 61000 - 3 - 4
IEC/TC EN 61000 - 3 - 5
IEC EN 61000 - 4 - 2
IEC EN 61000 - 4 - 3
IEC EN 61000 - 4 - 4
IEC EN 61000 - 4 - 5
IEC EN 61000 - 4 - 6
IEC EN 61000 - 4 - 7
IEC EN 61000 - 4 - 8
IEC EN 61000 - 4 - 9
IEC EN 61000 - 4 - 11
European
EN 50 081 part 1
EN 50 081 part 2
EN 55 011
EN 55 013
EN 55 014
EN 55 015
EN 55 020
EN 55 022
EN 55 024
EN 50 082 part 1
EN 50 082 part 2
EN 50 093
American
FCC Part 15
MIL-STD - 461E